Ziptronix 3D interconnect tech targets multilayer CMOS ICs
April 5, 2007 - Ziptronix Inc. and Raytheon Vision Systems (RVS) feature they hit demonstrated sympathy of Ziptronix’s “direct stick interconnect” (DBI) link profession with multilayer CMOS IC processes, involving 3D combining of five-layer metal 0.5-micron CMOS devices with semiconductor PIN device devices.