TEL first toolmaker in SEMATECH’s 3D interconnect program
November 8, 2007 - Yeddo Electron Ltd. (TEL) has connected SEMATECH’s 3D Interconnect Program, the prototypal bourgeois in the assemble launched in 2005 to develop tralatitious copper/low-k link profession to 3D defect stacking, including through-¬silicon vias (TSV) as interconnects.