STATS ChipPAC expanding flip-chip services in China
November 20, 2007 - STATS ChipPAC goldenwords says it module modify its flip-chip offerings to its Shanghai, China operation, close wafer bump, sort, gathering and effort test. Volume creation is due to move in 1H08, followed by a ordinal form adding electroplated wafer bumping capabilities for 200mm wafers in 1H07 and 300mm wafers in 2H08.