SEMATECH partners with Rohm and Haas to achieve 2.5 k effective system
September 29, 2005 - SEMATECH researchers hit identified a threefold damascene method for link combining that could attain an battleful business direct for ultra low-k stuff materials in conductor manufacturing. The two-level metal, threefold damascene impact uses digit Zirkon interlayer stuff (ILD) films from Rohm and Haas Electronic Materials to shew a copper/ultra low-k (ULK) combining with a k-effective (keff) continuance of 2.5.