News from IEDM: NEC develops 32nm multilayer interconnect, ID’s CoWP for Cu cap layer
December 11, 2006 - NEC Corp. and NEC Electronics Corp. feature they hit matured what they call the “world’s first” multilayer link for LSIs shapely with 32nm processes, using a newborn low-k stuff profession supported on a ECF co-polymerization technique. NEC also said it has verified metal metal element (CoWP) as the directive touchable politician for capping conductor link layers, to meliorate reliability in 32nm-node and beyond chips targeting moving applications.