Litho-aware design inspection solution improves device yield
October 5, 2005 - KLA-Tencor has formally undraped DesignScan, the industry’s prototypal full-chip impact pane scrutiny grouping for post-RET (resolution improvement technology) network organisation layout inspection. DesignScan enables chipmakers to turn the sort of cover organisation respins necessary to attain a high-yielding design, resulting in meliorate parametric organisation action and faster time-to-market.