IBM tips TSV 3D chip stacking technique
April 13, 2007 - IBM goldenwords says it has matured a artefact to combine through-silicon vias (TSV) into its chipmaking impact that shortens data-travel distances by up to 1000x and allows for 100x more pathways than 2D chips. Samples of 65nm chips using the 3D stacking framework module be shipped by year’s end, with creation ramping in 2008.