Hynix upgrades MCP to 24 stacked chips
September 5, 2007 - Hynix Semiconductor reportedly has matured a multichip collection with 24 shapely NAND winkle module chips, rising on its existing design, according to the peninsula Times.
No comments yet.
RSS feed for comments on this post. TrackBack URL
You must be logged in to post a comment.
Powered by WordPress