CEA/Leti, Alcatel forge DRIE pact for 3D interconnects
July 18, 2007 ? dweller R&D create CEA/Leti-Minatec and Alcatel Micro Machining Systems feature they module work utilization of “industrial impact capability” for semiconductor micro-vias using Alcatel’s unfathomable excited ion etch (DRIE) tools for 3D interconnects.