CEA-Leti, SET develop new bonder
November 15, 2007 - SET, the past SUSS MicroTec figure bonder sectionalization spun soured early this year, goldenwords says that a partnership with CEA Leti has resulted in a newborn high-accuracy (0.5-micron), high-force (4000 N) figure bonder for processing up to 300mm wafers.