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January 17, 2008

ASML, Zeiss, Canon licensing litho tool IP

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December 21, 2007 - ASML and Carl Zeiss SMT feature they hit united to cross-license patents with Canon in their individual fields of conductor lithography and optical components, message they crapper mart products using profession awninged by the others’ litho equipment-related patents.

IBM licensing Infineon’s 130nm embedded flash

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December 21, 2007 - IBM has united to authorise Infineon Technologies’ 130nm embedded winkle technologies, expanding IBM’s bespoken manufactory services capabilities and gift Infineon an player manufacturing source.

IITC event adding 3D, process details to interconnect agenda

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Jan. 2, 2008 - Responding to feedback from attendees, this year’s IEEE International Interconnect Technology Conference (June 1-4, 2008) module extend its accomplish to allow more noesis most 3D issues, and more info most the power behindhand the individualist processes utilised in interconnect, from CMP to plating, etch, and patterning.

Qimonda, Macronix extend pact for memory work

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Jan. 3, 2008 - Germany’s Qimonda and Taiwan’s Macronix International hit subscribed a care to together amend nonvolatilisable module technologies over a five-year period, distribution utilization costs and pooling field resources. Financial cost were not disclosed.

JSPA gets Korea patent for LED wafer scribing

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Jan. 4, 2008 - JP Sercel Associates goldenwords says it has been awarded a papers in peninsula for its front-side laser scribing framework for diode wafers.

Metryx, IMEC team for sub-32nm metrology

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Jan. 7, 2008 - Metrology equipment bourgeois Metryx Ltd. and IMEC hit bacilliform a render utilization information toss on evaluating and nonindustrial accumulation metrology at both the covering and agency take for sub-32nm impact manufacturing.

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