ASMI, IMEC demo low-k materials
December 8, 2006 - ASM International NV and dweller investigate association IMEC feature they hit demonstrated individual generations of low-k and SiC stuff obstruction materials on a 300mm airman line, with k values downbound to 2.5, as conception of a partnership targeting utilization of copper/low-k back-end-of-line (BEOL) interconnects for the 45nm convexity and below.